Yongzhi XU

Spearheaded the development of phone display and frame assembly automation equipment across 14+ stations and multiple vendors, enhancing line capacity by 18% for 2 generations of ramp success.

Directed the development of phone enclosure frame band automation for 10+ stations in the Chengdu factory, achieving target Overall Equipment Effectiveness (OEE) for ramp modules.

Designed and implemented a new assembly line, increasing capacity by up to 50% through new layouts, conveyor systems, modular design, auto-calibration, and software optimization.

Led automation innovation and new process development for N+1 programs, contributing to the strategic vision of a smart factory.

Drove automation improvements for manufacturing, significantly enhancing yield, reducing cycle time, shortening lead time, decreasing labor, and minimizing process breaks while meeting cost targets.

Developed a new optical module for laser cut machines, improving sapphire cut performance and reducing HG laser-cut chipping issues from 1.5% to less than 0.5%.

Optimized back glass FQC AOI automation capacity by improving IE layout and machine cycle time, reducing downtime by 6%, and increasing capacity by 11%.

Reduced labor costs by over 60% through leading watch printer automation from concept to mass production implementation.

Successfully established and managed the Mechanical Department, building a foundational team and operational framework.

Developed and implemented comprehensive Mechanical Design Specifications and Standards, improving departmental efficiency and product quality.

Provided technical training and mentorship to the mechanical design team, enhancing overall team capabilities and project execution.

Directed mechanical system design, manufacturing, and testing processes for various projects, ensuring adherence to quality and performance benchmarks.

Led the Chengdu Satellite Team, comprising Mechanical, Electrical/Electronic, Software, and Module Test engineers, to independently develop and localize SIPLACE placement sub-modules.

Successfully developed equipment within target cost and performance requirements, enhancing product competitiveness.

Spearheaded the development and release of core projects, including two types of JEDEC Tray Feeders for E-series and TX-series, and a Reject Conveyor for expensive IC components.

Managed project evaluations with Singapore and Munich PM/R&D, ensuring project feasibility, resource planning, and adherence to schedule and cost targets.

Guided team members through detailed design, quality assurance, and documentation (MDS, IP) processes, ensuring compliance with PLM standards.

Supported Singapore & Global R&D efforts on E-Series & TX-Series Machines, including components like JEDEC Tray Feeders, Reject Conveyors, and Electrical Tape Cutters.

Conceptualized and managed multiple mechanical design projects, successfully passing PM review stages.

Supported the development and testing phases for E-Series Placement machines, ensuring product quality and performance.

Performed sustaining projects on D-Series Placement Machines, contributing to ongoing product reliability and maintenance.

Gained comprehensive familiarity with SMT technology of SIPLACE and the associated development system through intensive training and hands-on experience.

Developed the first-generation SPI (Solder Paste Inspection) machine, 'ASM ProcessExpert', launched in 2015, integrating optical 2D and 3D measurement technologies.

Served as a Core Designer for the SPI project, focusing on the frame, conveyor system, and optical module design, ensuring robust mechanical integration.

Developed sub-modules for other semiconductor products, including Mask Aligner and Lead Frame AOI, expanding product capabilities.

Supported the assembly and testing of SPI, ensuring smooth integration and validation of mechanical components.

Designed tooling, jigs for assembly, and test benches for module testing, streamlining the production and quality assurance processes.

Led the mechanical development of Laser Marker equipment, including the successful release of the CO2 Laser Marker.

Developed a new generation Fiber Laser Marker, resolving older version issues, improving marking principles, and optimizing fiber layout and thermal design.

Managed the laboratory, including equipment maintenance, tool management, and the construction of experimental platforms, ensuring efficient R&D operations.

Served as the core mechanical designer for the main IC Test Handler's in-house Laser Marker project, focusing on laser head, engine, and platform design.

Summarized Bill of Materials (BOM) and cost data for Laser Markers, contributing to cost-effective design solutions.

Customized special cutting tools based on customer orders and marketing requirements, ensuring precise product delivery.

Developed new production processes and jigs, enhancing production efficiency and product quality.

Managed the entire production process from customer requirements and custom design to tool design, production, packing, and delivery.

Drafted tool parts, assembly drawings, and production processes, contributing to streamlined manufacturing workflows.